RDL (Redistribution Layer) is used to re-arrange bond pad into 3~10mm thick polymer composition of the area-distributed pad array. These layers can be low-k dielectric layer, which is a widely applied as the material BCB. Using Thick Cu as RDL materials can satisfy the needs of a device with larger current.
High-performance electronics required high conductivity, needs the capability of transferring higher current, by using wafer level packaging and re-distribution, selects the electroplating thick Cu for distribution and puts on layer to achieve the required conductivity and reliability.
Application products:
1. Power IC)
2. magnetic coupler
3. RF device:Wireless (RF, TV)RF PA, RF LNA, RF Transceiver.
Process Flow:
●Advanced Furnace Systems Corp.
●SOUTHERN TAIWNA SCENCE PARK
●Add :
3F.-2, No.19, Nanke 3rd Rd., Sinshih Township, Tainan County 744, Taiwan (R.O.C.)
●E-mail: cmchu.afs@msa.hinet.net
●Tel : +886-6-505-3705 Ext : 10
●Fax :+886-6-505-3711
